ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE

摘要

The present invention provides an anisotropic conductive film and an electronic device to resolve the problem that deformation of a micro-electronic element due to high temperature easily causes a failure in a fine connecting line in packaging connection using a heat curing-type conductive film. The anisotropic conductive film given in the present invention includes a base film and a micro-capsule structure. The micro-capsule structure is placed on the base film. The micro-capsule structure includes: conductive metal particles; high-molecule polymers which are coated onto the outside of the conductive metal particles and can be cured at room temperature; and a micro-capsule wall which is coated onto the outside of the high-molecule polymers. On the outer surface of the micro-capsule wall, an adhesive is applied. As the conductive metal particles and the high-molecule polymers capable of being cured at room temperature are used as core material and the micro-capsule structure is used for the wall, it is possible to destruct the micro-capsule structure through pressurization and expose the conductive particles and the room-temperature-curable high-molecule polymers inside so that the exposed room-temperature-curable high-molecule polymers can be cured and a micro-electronic element can be electrically conducted and connected at room temperature using the anisotropic conductive film.