| 摘要 |
<p>The present invention relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die as a first electrical interconnect and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die as a second electrical interconnect and positioned on a second major surface of the electronic chip package different from the first major surface.</p> |
