Overlapping interconnect signal lines for reducing capacitive coupling effects

摘要

Described herein are various principles for designing, manufacturing, and operating integrated circuits having functional components and one or more metal interconnect layers, where the dimensions of signal lines of the metal interconnect layers are larger than dimensions of the functional components. In some embodiments, a signal line may have a width greater than a width of a terminal of a functional component to which the signal line is connected. In some embodiments, two functional components formed in a same functional layer of the integrated circuit may be connected to metal signal lines in different metal interconnect layers. Further, the metal signal lines of the different metal interconnect layers may overlap some distance.

主权项

1. An integrated circuit comprising:
a first layer having a first semiconductor component and a second semiconductor component; a first signal line disposed a first distance from the first layer, the first signal line being electrically connected to the first semiconductor component; and a second signal line disposed a second distance from the first layer, the second distance being greater than the first distance, the second signal line being electrically connected to the second semiconductor component, wherein:
the first signal line and the second signal line extend across the integrated circuit for a third distance in a direction,a plurality of other semiconductor components are arranged in a line in the direction,at least a portion of the second signal line is disposed vertically above at least a portion of the first signal line for at least the third distance, andthe first signal line is disposed vertically above the plurality of other semiconductor components.