发明名称 Solid-state imaging device
摘要 A solid-state imaging device includes: a plurality of pixel cells; and column signal lines. Each of the pixel cells includes: a photoelectric conversion film, a pixel electrode, a transparent electrode, an amplifier transistor, a reset transistor, and an address transistor. The solid-state imaging device further includes: a lower-refractive-index transparent layer formed above the transparent electrode; and higher-refractive-index transparent parts embedded in the lower-refractive-index transparent layer and each having a refractive index higher than a refractive index of the lower-refractive-index transparent layer. Each of the higher-refractive-index transparent parts separates light passing through the higher-refractive-index transparent part into zero-order diffracted light, first-order diffracted light, and negative-first-order diffracted light which exit the higher-refractive-index transparent part and travel toward the photoelectric conversion film.
申请公布号 US8759931(B2) 申请公布日期 2014.06.24
申请号 US201213716264 申请日期 2012.12.17
申请人 Panasonic Corporation 发明人 Toshikiyo Kimiaki;Itakura Keijirou
分类号 H01L31/0232;H01L27/146 主分类号 H01L31/0232
代理机构 Wenderoth, Lind & Ponack, LLP. 代理人 Wenderoth, Lind & Ponack, LLP.
主权项 1. A solid-state imaging device comprising: pixel cells arranged in rows and columns; and column signal lines each of which is provided for a corresponding one of the columns and transmits signal voltages of the pixel cells in the corresponding column, the pixel cells each including: a photoelectric conversion film which is formed above a semiconductor substrate and converts incident light into electric charges; a pixel electrode which is formed on one surface of the photoelectric conversion film and is in contact with the photoelectric conversion film, the one surface facing the semiconductor substrate; a transparent electrode which is formed on the other surface of the photoelectric conversion film and applies a constant voltage to the photoelectric conversion film, the other surface being an opposite surface to the one surface facing the semiconductor substrate; an amplifier transistor which is a transistor formed in the semiconductor substrate, has a gate electrode connected to the pixel electrode, and outputs a signal voltage depending on a potential of the pixel electrode; a reset transistor which is a transistor formed in the semiconductor substrate and resets a potential of the gate electrode of the amplifier transistor; and an address transistor which is a transistor formed in the semiconductor substrate, is provided between the amplifier transistor and the column signal line, and causes the pixel cell to output the signal voltage to the column signal line, and the solid-state imaging device further comprising: a lower-refractive-index transparent layer formed above the transparent electrode; and a plurality of higher-refractive-index transparent parts embedded in the lower-refractive-index transparent layer and each having a refractive index higher than a refractive index of the lower-refractive-index transparent layer, wherein each of the higher-refractive-index transparent parts separates light passing through the higher-refractive-index transparent part into zero-order diffracted light, first-order diffracted light, and negative-first-order diffracted light which exit the higher-refractive-index transparent part and travel toward the photoelectric conversion film.
地址 Osaka JP