发明名称 |
Heat-dissipation structure for a portable folding electronic apparatus |
摘要 |
A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support. |
申请公布号 |
US8760864(B2) |
申请公布日期 |
2014.06.24 |
申请号 |
US201213459244 |
申请日期 |
2012.04.29 |
申请人 |
AU Optronics Corp. |
发明人 |
Chiang Ho-Hsing |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
主权项 |
1. An heat-dissipation structure for a portable folding electronic apparatus, the portable folding electronic apparatus comprising a first casing, a second casing, a hinge connecting the first casing and the second casing, and a panel module disposed in the first casing, the panel module comprising a frame and a light source disposed at a corner of the frame, the heat-dissipation structure comprising:
a hinge support, connected to the hinge and the frame; and a heat-conducting device, mounted on the hinge support and near the light source.
|
地址 |
Science-Based Industrial Park, Hsin-Chu TW |