发明名称 Heat-dissipation structure for a portable folding electronic apparatus
摘要 A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.
申请公布号 US8760864(B2) 申请公布日期 2014.06.24
申请号 US201213459244 申请日期 2012.04.29
申请人 AU Optronics Corp. 发明人 Chiang Ho-Hsing
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. An heat-dissipation structure for a portable folding electronic apparatus, the portable folding electronic apparatus comprising a first casing, a second casing, a hinge connecting the first casing and the second casing, and a panel module disposed in the first casing, the panel module comprising a frame and a light source disposed at a corner of the frame, the heat-dissipation structure comprising: a hinge support, connected to the hinge and the frame; and a heat-conducting device, mounted on the hinge support and near the light source.
地址 Science-Based Industrial Park, Hsin-Chu TW