Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method

摘要

A method includes applying, between connection conductors of adjacent substrates, a junction material containing the first metal or alloy component and the second metal or alloy component having a higher melting point than said first metal or alloy component. The method further includes melting the junction material by a heat treatment.

主权项

1. A method for manufacturing a substrate, the method comprising the steps of:
placing a substrate with a minute space in a processing chamber; filling said minute space with an inorganic insulating paste material by first reducing and then increasing a pressure of an atmosphere in said processing chamber; and hardening said inorganic insulating material while applying a centrifugal force due to rotation of said substrate to said inorganic insulating paste material in said minute space.