Temperature unifying and heat storing system of semiconductor heat loss through natural temperature maintaining member

摘要

The primary purpose of the present invention is to provide a heat equalizer and the fluid transmission duct disposed in a heat carrier existing in solid state in the nature where presents comparatively larger and more stable heat carrying capacity for passing through the fluid. The fluid passes through the solid or gas state semiconductor application installation to regulate temperature equalization of the semiconductor application installation and flows back to the heat equalization installation disposed in the natural heat carrier for the heat equalization installation providing good heat conduction in the natural heat carrier to provide the operation of temperature equalization regulating function on the backflow of the fluid, and through the heat equalizer to transfer thermal energy to the heat storing block constituted by the surrounding natural heat carrier so as to store heat for releasing thermal energy to the specified heat releasing target.

主权项

1. A temperature unifying and heat storing system for transferring heat from a semiconductor application installation (103) and storing the heat in a heat storing block (1500) surrounded by a natural heat carrier (101) for release to a predetermined heat release target (2000), comprising:
at least one heat equalizer (102) surrounded by the natural heat carrier (101) for receiving heat generated by at least one semiconductor device in the semiconductor device installation (103) via a fluid passage through the heat equalizer (102) and transferring the heat to the heat storing block (1500) in the surrounding natural heat carrier (101), the heat storing block (1500) storing the heat for release to the predetermined heat release target (2000); the semiconductor application installation (103) including the at least one semiconductor device, a semiconductor device temperature equalization structure for dissipating heat generated by the at least one semiconductor device, and a semiconductor device duct through which a fluid (104) passes to receive the heat from the semiconductor device temperature equalization structure; a fluid transmission duct (105) connected to the semiconductor device duct to enable the fluid (104) to circulate into and out of the semiconductor application installation (103) in response to one of (i) natural convection and (ii) a pump (106) for pumping the fluid (104) through the fluid transmission duct (105) and the semiconductor application installation (103); and a control unit (110) for controlling circulation of the fluid (104) through the semiconductor application installation (103).