POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a power module package and a method for manufacturing the same. The power module package according to the embodiment of the present invention includes an external connection terminal; a substrate which has a combination unit which is inserted into one end of the external connection terminal; and a semiconductor chip which is mounted on one surface of the substrate. According to one embodiment of the present invention, the substrate includes a metal plate; an insulating layer which is formed on the metal plate; and a circuit pattern which is formed on the insulating layer.