发明名称 Deposition system with a rotating drum
摘要 A deposition method comprises flowing a first gas into a metallization zone maintained at a first pressure. A second gas flows into a reaction zone maintained at a second pressure. The second pressure is less than the first pressure. A rotating drum includes at least one substrate mounted to a surface of the drum. The surface alternately passes through the metallization zone and passes through the reaction zone. A target is sputtered in the metallization zone to create a film on the at least one substrate. The film on the at least one substrate is reacted in the reaction zone.
申请公布号 US8758580(B2) 申请公布日期 2014.06.24
申请号 US201113211884 申请日期 2011.08.17
申请人 Vaeco Inc. 发明人 DeVito Richard
分类号 C23C14/22;C23C14/50 主分类号 C23C14/22
代理机构 Pepper Hamilton LLP 代理人 Mollaaghababa Reza;Engellenner Thomas J.;Pepper Hamilton LLP
主权项 1. A deposition system comprising a metallization zone including a sputtering system for metal film deposition; a reaction zone including an ionization source for generating at least one reactive ionic species; a rotatable mount configured to hold at least one substrate and to pass at least a portion of the substrate alternately through said metallization and reaction zones so as to deposit a metal film on said substrate portion in the metallization zone and to react the metal film with said at least one reactive ionic species in said reaction zone; and at least one diffusive gas barrier disposed between said metallization and reaction zones for maintaining a pressure differential therebetween, wherein the reaction zone comprises a pair of inner baffles interposed between a pair of differential pumps, and a pair of outer baffles between which the differential pumps are interposed.
地址 Jamaica Plain MA US