| 发明名称 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | ||
| 摘要 | A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion, the contact protrusion having a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall; forming a die paddle, adjacent to the isolated contact, having a die paddle protrusion, the die paddle protrusion having a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall; depositing a contact pad on the contact protrusion; depositing a die paddle pad on the die paddle protrusion; coupling an integrated circuit die to the contact protrusion; and molding an encapsulation on the integrated circuit die. | ||
| 申请公布号 | US8759159(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201113102047 | 申请日期 | 2011.05.05 |
| 申请人 | Stats ChipPac Ltd. | 发明人 | Do Byung Tai;Trasporto Arnel Senosa;Chua Linda Pei Ee |
| 分类号 | H01L21/44;H01L21/48;H01L21/50 | 主分类号 | H01L21/44 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method of manufacture of an integrated circuit packaging system comprising: forming an isolated contact having a side protrusion and a contact protrusion, the side protrusion having a curved surface, the contact protrusion having a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall; forming a die paddle, adjacent to the isolated contact, having a die paddle protrusion, the die paddle protrusion having a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall; depositing a contact pad on the contact protrusion; depositing a die paddle pad on the die paddle protrusion; coupling an integrated circuit die to the contact protrusion; and molding an encapsulation on the integrated circuit die. | ||
| 地址 | Singapore SG | ||