Semiconductor package and package on package having the same

摘要

A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.

主权项

1. A semiconductor package comprising:
a substrate; a semiconductor chip attached to a surface of the substrate; a plurality of connecting conductors; and a mold formed on the substrate for holding the semiconductor chip and comprising a plurality of via holes which expose corresponding ones of the connecting conductors through the mold, wherein, for a first via hole of the plurality of via holes, a planar distance between a connecting conductor exposed by the first via hole and an entrance of the first via hole is not uniform.