Method of grooving a chemical-mechanical planarization pad

摘要

A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≦(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.

主权项

1. A method of forming a chemical-mechanical planarization pad, comprising:
polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface; removing material from the surface of said pad to form grooves in said surface and lands between said grooves, wherein said grooves have a first width (W1); and shrinking said lands from a first land length (L1) at said surface to a second land length (L2) at said surface, wherein said second land length (L2) is less than said first land length (L1) and said grooves have a second width (W2) wherein (W1)≦(X) (W2), wherein (X) has a value in the range of 0.01 to 0.75; wherein shrinking said lands comprises further polymerizing said polymer precursors after forming grooves in said surface.