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1. A wiring substrate comprising:
a substrate body including a first surface, a second surface provided on an opposite side of the first surface, a first outer peripheral side surface that connects the first and second surfaces and is located at an outer peripheral part of the substrate body, and a through-hole penetrating the substrate body from the first surface to the second surface; a first insulating film formed on the first surface of the substrate body and a side surface of the through-hole, the first insulating film including a first inner side surface contacting the first surface of the substrate body, an outer peripheral side surface located at an outer peripheral part of the first insulating film, and a front surface provided on an opposite side of the first inner surface; a second insulating film formed on the second surface of the substrate body, the second insulating film including a second inner side surface contacting the second surface of the substrate body, and an outer peripheral side surface located at an outer peripheral part of the second insulating film, and a front surface provided on an opposite side of the second inner surface; a penetration electrode formed in the through-hole, the penetration electrode including one end that is substantially flush with the front surface of the first insulating film, and another end that is substantially flush with the second surface of the substrate body; a first wiring pattern electrically connected to the one end of the penetration electrode and provided on the front surface of the first insulating film, the first wiring pattern including a first pad to which an electronic component is connected; a second wiring pattern electrically connected to the other end of the penetration electrode and provided on the front surface of the second insulating film, the second wiring pattern including a second pad to which another electronic component is connected; a first insulating resin layer provided on the front surface of the first insulating film to cover the first wiring pattern, the first insulating resin layer including an opening part that exposes the first pad, and an outer peripheral side surface located at an outer peripheral part of the first insulating resin layer; a second insulating resin layer provided on the front surface of the second insulating film to cover the second wiring pattern, the second insulating layer including an opening part that exposes the second pad, and an outer peripheral side surface located at an outer peripheral part of the second insulating resin layer; a notch part provided at an outer peripheral part of the substrate body, the notch part being a recess defined by the first inner side surface of the first insulating film, the second inner side surface of the second insulating film, and the first outer peripheral side surface of the substrate body, the first outer peripheral side surface being located more inward than the outer peripheral side surface of the first insulating film, the outer peripheral side surface of the second insulating film, the outer peripheral side surface of the first insulating resin layer, and the outer peripheral side surface of the second insulating resin layer; and a resin provided in the notch part and including an outer peripheral side surface that is substantially flush with the outer peripheral side surface of the first insulating film, the outer peripheral side surface of the second insulating film, the outer peripheral side surface of the first insulating resin layer, and the outer peripheral side surface of the second insulating resin layer; wherein the notch part is a plurality of notch parts provided in the outer peripheral part of the substrate body, wherein the plurality of notch parts are independent from each other.
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