LOW DAMAGE SPUTTERING APPARATUS AND SPUTTERING METHOD USING THE SAME

摘要

The present invention relates to a low-damage sputtering apparatus capable of drastically reducing damages to a substrate when forming a film compared to a traditional sputtering system and to a sputtering method using the same. The sputtering apparatus according to an embodiment of the present invention includes a chamber for providing a reaction space; a target installed on one side of the chamber; a substrate support installed to face the target; a power source unit for supplying power to the target; an additional electrode installed between the target and the substrate support for applying a negative voltage. A mesh portion having multiple holes is formed on an entire or a portion of the additional electrode, so that the target particles fallen off from the target can pass through.