| 摘要 |
The present invention relates to a semiconductor package and a method of manufacturing the same. A semiconductor package according to the present invention includes: a substrate which includes a circuit layer and an insulating layer; a semiconductor chip which is mounted on the substrate; and a protective layer which is stacked on the semiconductor chip and protects the semiconductor chip. The insulating layer is a first composite member where a first fiber member is filled with a first resin. The protective layer is a second composite member where a second fiber member is filled with a second resin. |
