MEMBRANE OF A CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING HEAD OF A CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

Disclosed are a membrane of a chemical mechanical polishing apparatus and a polishing head of the chemical mechanical polishing apparatus. A polishing head of a chemical mechanical polishing apparatus according to an embodiment of the present invention comprises a housing which moves up and down; a base assembly which is connected to the lower part of the housing and supports the housing; a membrane which is prepared on the lower part of the base assembly, and absorbs and pressurizes the substrate; and a retainer ring which is connected to the lower part of the base assembly and surrounds the membrane. The membrane comprises a pressurizing part which absorbs and pressurizes the substrate; a first partition wall which is extended from the edge part of the pressuring part in a height direction; a first horizontal extension part which is extended from the upper part of the first partition wall to the center direction of the pressurizing part; and a second horizontal extension part which is extended from the upper part of the first partition part to the center direction of the pressurizing part, is arranged on the upper part of the first horizontal extension part, and has a curved part which is expanded by air pressure.