| 摘要 |
The method involves analyzing heat dissipating components e.g. microprocessor, to position the heat dissipating components on a side of a printed circuit board i.e. motherboard (1) in a computer, while permitting simple addition of a heat pipe system (2) in the board. Electronic components of the board are positioned at maximal distance of the heat dissipating components, where the computer is placed without an active fan type ventilator for dissipating heat. |
