发明名称 METHOD FOR FORMING PATTERN ON SURFACE OF BOARD AND PATTERN-FORMED BOARD FORMED BY METHOD
摘要 Disclosed herein are a method for forming a pattern on a surface of a board and a pattern-formed board manufactured by the method. The method includes: arranging hot-fix pieces (10) in a predetermined form, thus forming a hot-fix-piece pattern unit (100); maintaining the hot-fix-piece pattern unit (100) and temporarily-adhering temporary adhesive tape to dome-shaped parts (10c) of the hot-fix pieces (10) of the hot-fix-piece pattern unit (100); disposing adhesive layers (10b) of the hot-fix pieces (10) of the hot-fix-piece pattern unit (100) and applying heat to the thin plate (12) so that the adhesive layers (10b) of the hot-fix pieces (10) are attached to the thin plate (12); applying an adhesive to a rear surface of the thin plate (12) and attaching the thin plate (12) to an opening and closing board (13); and surface-treating the opening and closing board (13).
申请公布号 US2014170396(A1) 申请公布日期 2014.06.19
申请号 US201214237171 申请日期 2012.08.03
申请人 Lee Sang Geun 发明人 Lee Sang Geun
分类号 B44C3/12 主分类号 B44C3/12
代理机构 代理人
主权项 1. A method for forming a pattern on a surface of a board, comprising: arranging a plurality of hot-fix pieces (10) in a predetermined form, thus forming a hot-fix-piece pattern unit (100); maintaining the hot-fix-piece pattern unit (100) that has the hot-fix pieces (10) arranged in the predetermined form, and temporarily-adhering temporary adhesive tape to dome-shaped parts (10c) of the hot-fix pieces (10) of the hot-fix-piece pattern unit (100) such that the hot-fix pieces (10) of the hot-fix-piece pattern unit (100) are arranged in an opposite form; disposing adhesive layers (10b) of the hot-fix pieces (10) of the hot-fix-piece pattern unit (100) temporarily-adhered to the temporary adhesive tape (11) on a thin plate (12), and applying heat to the thin plate (12) so that the adhesive layers (10b) of the hot-fix pieces (10) are attached to the thin plate (12), whereby the hot-fix-piece pattern unit (100) is attached to the thin plate (12); applying an adhesive to a rear surface of the thin plate (12) to which the hot-fix-piece pattern unit (100) has been attached, and attaching the thin plate (12) to an opening and closing board (13); and surface-treating the opening and closing board (13) to which the thin plate (12) has been attached.
地址 Gyeonggi-Do KR