| 发明名称 |
Method for Testing Semiconductor Chips or Semiconductor Chip Modules |
| 摘要 |
A semiconductor chip panel includes a plurality of semiconductor chips embedded in an encapsulation material. At least part of the semiconductor chips comprise a first electrical contact element on a first main face and a second electrical contact element on a second main opposite to the first main face, respectively. One of the plurality of semiconductor chips is tested by establishing an electrical contact between a test contact device and the first electrical contact element and between an electrically conductive holder and the second contact element. |
| 申请公布号 |
US2014167800(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201213715990 |
申请日期 |
2012.12.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Fuergut Edward;Groeninger Horst |
| 分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for testing semiconductor chips, the method comprising:
providing a semiconductor chip panel comprising a plurality of semiconductor chips embedded in an encapsulation material, wherein at least part of the semiconductor chips comprise a first electrical contact element on a first main face and a second electrical contact element on a second main opposite to the first main face, respectively; and testing one of the plurality of semiconductor chips by establishing an electrical contact between a test contact device and the first electrical contact element and between an electrically conductive holder and the second contact element.
|
| 地址 |
Neubiberg DE |
