发明名称 |
MODUL FUER BEHANDLUNG VON HALBLEITERSCHEIBEN |
摘要 |
A sputtering module incorporated into a wafer processing system includes an evacuatable housing connectable to one or more other evacuatable housings and a wafer handling turret adapted to receive a wafer in horizontal orientation at a load/unload position and rotate the wafer 180 DEG about an inclined axis into vertical orientation at a sputtering position across from a sputtering target. After sputter coating, the wafer handling turret again rotates 180 DEG about the inclined axis to rotatably return the wafer to the horizontal load/unload position, whereupon the wafer is lowered to a horizontal receiving position for subsequent retrieval by an arm extendible into the module from an adjacently situated housing. The wafer handling turret includes three wafer holding rings and a disc-shaped shutter that is rotatably located in front of the target during precleaning. |
申请公布号 |
AT153180(T) |
申请公布日期 |
1997.05.15 |
申请号 |
AT19920905171T |
申请日期 |
1992.01.21 |
申请人 |
MATERIALS RESEARCH CORPORATION |
发明人 |
HODOS, JULIAN;HURWITT, STEVEN |
分类号 |
B65G49/07;C23C14/50;C23C14/56;H01L21/203;H01L21/677;H01L21/683;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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