| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for suppressing the generation of particles in a chamber.SOLUTION: A sputtering device 1 includes: a substrate holder 7 which is installed in a treatment chamber 2 for deposition treatment to mount a substrate 10; a target holder 6 which is installed in the treatment chamber 2; a shutter 19 which can move to a shielding state of shielding between the substrate holder 7 and the target holder 6 or move to a retracted state of being retracted from between the substrate holder 7 and the target holder 6; driving means 32 which drives the shutter 19; a shutter storage part 23 which has an opening part for allowing the shutter 19 to be put in and taken out of the treatment chamber 2 and stores the shutter 19 in the retracted state; and a gas introduction pipe for introducing gas into the treatment chamber 2. The gas introduction pipe is installed in the shutter storage part 23 and introduced into the treatment chamber 2 through the opening part.</p> |
