发明名称 |
EPITAXIAL LAYER WAFER HAVING VOID FOR SEPARATING GROWTH SUBSTRATE THEREFROM AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME |
摘要 |
An epitaxial wafer having a void for separation of a substrate and a semiconductor device fabricated using the same. The epitaxial wafer includes a substrate, a mask pattern disposed on the substrate and comprising a masking region and an opening region, and an epitaxial layer covering the mask pattern. The epitaxial layer includes a void disposed on the masking region.;The epitaxial layer can be separated from the growth substrate by applying chemical lift-off or stress lift-off, at the void. |
申请公布号 |
US2014167086(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201314105919 |
申请日期 |
2013.12.13 |
申请人 |
SEOUL VIOSYS CO., LTD. |
发明人 |
JANG Jong Min;LEE Kyu-Ho;HAN Chang Suk;KIM Hwa Mok;SUH Daewoong;IN Chi Hyun;CHAE Jong Hyeon |
分类号 |
H01L33/22;H01L21/02;H01L33/00;H01L29/06 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
1. An epitaxial wafer comprising:
a growth substrate; a mask pattern disposed on the growth substrate and comprising a masking region and an opening region; and an epitaxial layer covering the mask pattern and comprising a void disposed on the masking region.
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地址 |
Ansan-si KR |