发明名称 EPITAXIAL LAYER WAFER HAVING VOID FOR SEPARATING GROWTH SUBSTRATE THEREFROM AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME
摘要 An epitaxial wafer having a void for separation of a substrate and a semiconductor device fabricated using the same. The epitaxial wafer includes a substrate, a mask pattern disposed on the substrate and comprising a masking region and an opening region, and an epitaxial layer covering the mask pattern. The epitaxial layer includes a void disposed on the masking region.;The epitaxial layer can be separated from the growth substrate by applying chemical lift-off or stress lift-off, at the void.
申请公布号 US2014167086(A1) 申请公布日期 2014.06.19
申请号 US201314105919 申请日期 2013.12.13
申请人 SEOUL VIOSYS CO., LTD. 发明人 JANG Jong Min;LEE Kyu-Ho;HAN Chang Suk;KIM Hwa Mok;SUH Daewoong;IN Chi Hyun;CHAE Jong Hyeon
分类号 H01L33/22;H01L21/02;H01L33/00;H01L29/06 主分类号 H01L33/22
代理机构 代理人
主权项 1. An epitaxial wafer comprising: a growth substrate; a mask pattern disposed on the growth substrate and comprising a masking region and an opening region; and an epitaxial layer covering the mask pattern and comprising a void disposed on the masking region.
地址 Ansan-si KR