| 摘要 |
A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent. |
| 主权项 |
1. An apparatus for wafer dicing comprising:
a dicing machine comprising a dicing saw; a dicing solution comprising:
at least one compound selected from the group consisting of an organic acid and salt thereof;a surfactant has low surface tension at low concentrations and low foaming;a base;the remainder being deionized water; andthe solution has a pH greater than 4;
whereinthe organic acid is selected from the group consisting of oxalic acid, citric acid, maliec acid, malic acid, malonic acid, gluconic acid, glutaric acid, ascorbic acid, formic acid, acetic acid, ethylene diamine tetraacetic acid, diethylene triamine pentaacetic acid, aminobenzoic acids such as anthranilic acid, fumaric acid, glycine, alanine, cystine, and the mixtures thereof;the surfactant is selected from the group consisting of anionic surfactants, cationic surfactants, non-ionic surfactants, zwitterionic surfactants, silicone surfactants, poly(alkylene oxide) surfactants, fluorochemical surfactants, acetylenic diol surfactants, primary alcohol ethoxylates, secondary alcohol ethoxylates, amine ethoxylates, glucosides, glucamides, polyethylene glycols, poly(ethylene glycol-co-propylene glycol), and combinations thereof; andthe base is selected from the group consisting of potassium hydroxide (KOH), guanidiene carbonate, aqueous ammonia, ammonium hydroxides and quaternary ammonium hydroxides; deionized water;
and a mixer containing mixture of the dicing solution and the deionized water; wherein the mixture of the dicing solution and the deionized water having a ratio from 1:0 to 1:10000; and the mixture is in contact with the wafer and the dicing saw.
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