| 发明名称 |
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME |
| 摘要 |
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. |
| 申请公布号 |
US2014167238(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201314019351 |
申请日期 |
2013.09.05 |
| 申请人 |
Fairchild Semiconductor Corporation |
发明人 |
Jeon Oseob;Choi Yoonhwa;Gooi Boon Huan;Estacio Maria Cristina B.;Chong David;Keng Tan Teik;Nam Shibaek;Joshi Rajeev;Wu Chung-Lin;Iyer Venkat;Lim Lay Yeap;Lee Byoung-Ok |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
San Jose CA US |
