| 摘要 |
A process including: (a) providing a gelable composition comprising a gelable semiconductor polymer and a liquid, wherein the polymer is at a low concentration in the liquid; (b) gelling the gelable composition to result in a gelled composition; (c) breaking the gelled composition to result in a flowable, broken gelled composition, wherein the viscosity of the flowable, broken gelled composition is at least about 10 times greater than the viscosity of the liquid; and (d) liquid depositing the flowable, broken gelled composition. |
