发明名称 |
CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction. |
申请公布号 |
US2014166346(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201314133238 |
申请日期 |
2013.12.18 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
OTSUKA Yuma;FUKUNAGA Kazunori;UCHIDA Atsushi;YOSHIMURA Kouhei |
分类号 |
H05K1/11;H05K1/03 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
1. A ceramic substrate comprising:
a ceramic substrate main body including a principal surface; a connecting terminal portion disposed on the principal surface of the ceramic substrate main body for connecting to a component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum, wherein the contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.
|
地址 |
Nagoya JP |