发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY STORAGE MEDIUM
摘要 A substrate processing apparatus includes a substrate holding part configured to hold and support a substrate, a heating module configured to heat a substrate, and a cooling module configured to cool the substrate heated in the heating module. The substrate processing apparatus further includes a substrate transfer mechanism configured to take out the substrate from the substrate holding part and to sequentially transfer the substrate to the heating module and the cooling module, and a control unit configured to set a cooling time of the substrate in the cooling module based on a transfer history of the substrate while the substrate heated in the heating module is loaded into the cooling module.
申请公布号 US2014170862(A1) 申请公布日期 2014.06.19
申请号 US201314089136 申请日期 2013.11.25
申请人 Tokyo Electron Limited 发明人 TOYODA Yoshinori
分类号 H01L21/263;H01L21/67;H01L21/677;H01L21/02 主分类号 H01L21/263
代理机构 代理人
主权项 1. A substrate processing apparatus, comprising a substrate holding part configured to hold and support a substrate; a heating module configured to heat a substrate; a cooling module configured to cool the substrate heated in the heating module; a substrate transfer mechanism configured to take out the substrate from the substrate holding part and to sequentially transfer the substrate to the heating module and to the cooling module; and a control unit configured to set a cooling time of the substrate in the cooling module based on a transfer history of the substrate while the substrate heated in the heating module is loaded into the cooling module.
地址 Tokyo JP