发明名称 |
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY STORAGE MEDIUM |
摘要 |
A substrate processing apparatus includes a substrate holding part configured to hold and support a substrate, a heating module configured to heat a substrate, and a cooling module configured to cool the substrate heated in the heating module. The substrate processing apparatus further includes a substrate transfer mechanism configured to take out the substrate from the substrate holding part and to sequentially transfer the substrate to the heating module and the cooling module, and a control unit configured to set a cooling time of the substrate in the cooling module based on a transfer history of the substrate while the substrate heated in the heating module is loaded into the cooling module. |
申请公布号 |
US2014170862(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201314089136 |
申请日期 |
2013.11.25 |
申请人 |
Tokyo Electron Limited |
发明人 |
TOYODA Yoshinori |
分类号 |
H01L21/263;H01L21/67;H01L21/677;H01L21/02 |
主分类号 |
H01L21/263 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate processing apparatus, comprising
a substrate holding part configured to hold and support a substrate; a heating module configured to heat a substrate; a cooling module configured to cool the substrate heated in the heating module; a substrate transfer mechanism configured to take out the substrate from the substrate holding part and to sequentially transfer the substrate to the heating module and to the cooling module; and a control unit configured to set a cooling time of the substrate in the cooling module based on a transfer history of the substrate while the substrate heated in the heating module is loaded into the cooling module.
|
地址 |
Tokyo JP |