| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power converter which achieves downsizing, improvement of the reliability, and high assembly yield and is excellent in dimensional stability of the finished product, and to provide a manufacturing method of the semiconductor power converter.SOLUTION: A semiconductor power converter comprises: a first conductor 34; a second conductor 36 which faces the first conductor so as to be spaced away from the first conductor; a first semiconductor element 38 where one electrode is joined to the first conductor; a second semiconductor element 40 where one electrode is joined to the first conductor; a first protruding type conductor 44a which is joined to the other electrode of the first semiconductor element; a second protruding type conductor 44b which is joined to the other electrode of the second semiconductor element; a plate like connection part which has a first opening and a second opening into which protruding parts of the first and second protruding type conductors fit, and is joined to the first and second protruding type conductors and the second conductor; a first power terminal; a second power terminal; a signal terminal; and an insulator 52 which covers base end parts of the first and second power terminals, a base end part of the signal terminal, and other component members. The insulator has a bottom surface which extends in a direction perpendicular to the first and second semiconductor elements and where the first and second conductors are exposed. |
