| 摘要 |
PROBLEM TO BE SOLVED: To perform reflow soldering to an insertion mounting component without causing heat stress.SOLUTION: A printed circuit board 10 where a heat resistant cover 20 is attached to an insertion mounting component 13 is transferred into a reflow furnace 1 and solder 12 of through holes 11 is heated to perform soldering without directly blowing hot air jetted from upper nozzles 2 onto the insertion mounting component 13. |
