SEMICONDUCTOR DEVICE

摘要

According to one embodiment, a semiconductor device includes a board and a semiconductor chip. The semiconductor chip includes a portion located outside the board in an extension direction of the board and a portion overlapping the board or an end face substantially aligned with an edge of the board in a thickness direction of the board.

主权项

1. A semiconductor device comprising:
a board comprising a first surface and a second surface at a side opposite to the first surface; an electronic component attached on the first surface of the board; a holder comprising a first portion attached on the first surface of the board and a second portion extending from the first portion in a first direction to be located outside the board; a semiconductor chip which comprises a first portion attached to the holder and a second portion extending from the first portion in a second direction opposite to the first direction to be located outside the holder, the second portion of the semiconductor facing the electronic component from a side opposite to the board; a bonding wire extending between the semiconductor chip and the board; and a seal member covering the board, the holder, and the semiconductor chip.