HOUSING DEVICE FOR WIRELESS COMMUNICATION HAVING HEAT DISSIPATION STRUCTURE

摘要

An enclosure device for a wireless communication apparatus having a heat dissipation structure of the present invention may comprise a stacked RF module consisting of a plurality of communication devices manufactured as functional modules; and a pair of heat dissipation plates attached to both sides of the stacked RF module in order to releases the heat, which is generated in the stacked RF module, to the outside.