发明名称 |
COMBINING STRUCTURE OF HEIGHT SENSOR |
摘要 |
The present invention relates to a coupling structure of a height sensor to firmly couple one opened side of a housing to a cover part in a height sensor. The coupling structure of a height sensor firmly couples the housing to the cover part by engaging a first coupling part on the housing with a second coupling part on the cover part. Also, the present invention accepts a burr, which is generated when the first coupling part on the housing is welded to the second coupling part on the cover part, in a space between the first and second coupling parts without removing the burr with a separate removal unit, thereby simplifying the manufacturing process. |
申请公布号 |
KR101409227(B1) |
申请公布日期 |
2014.06.18 |
申请号 |
KR20130017652 |
申请日期 |
2013.02.19 |
申请人 |
OMRON AUTOMOTIVE ELECTRONIC KOREA CO., LTD. |
发明人 |
KIM, SANG HYUN;LEE, JANG WON |
分类号 |
B60G17/015;G01B7/14 |
主分类号 |
B60G17/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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