发明名称 COMBINING STRUCTURE OF HEIGHT SENSOR
摘要 The present invention relates to a coupling structure of a height sensor to firmly couple one opened side of a housing to a cover part in a height sensor. The coupling structure of a height sensor firmly couples the housing to the cover part by engaging a first coupling part on the housing with a second coupling part on the cover part. Also, the present invention accepts a burr, which is generated when the first coupling part on the housing is welded to the second coupling part on the cover part, in a space between the first and second coupling parts without removing the burr with a separate removal unit, thereby simplifying the manufacturing process.
申请公布号 KR101409227(B1) 申请公布日期 2014.06.18
申请号 KR20130017652 申请日期 2013.02.19
申请人 OMRON AUTOMOTIVE ELECTRONIC KOREA CO., LTD. 发明人 KIM, SANG HYUN;LEE, JANG WON
分类号 B60G17/015;G01B7/14 主分类号 B60G17/015
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