| 发明名称 | Semiconductor chip including identifying marks | ||
| 摘要 | A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a first layer of the chip and a second mark within the first matrix identifying a position of the exposure field on a wafer. | ||
| 申请公布号 | US8754538(B2) | 申请公布日期 | 2014.06.17 |
| 申请号 | US200812145099 | 申请日期 | 2008.06.24 |
| 申请人 | Infineon Technologies AG | 发明人 | Ortner Jörg |
| 分类号 | H01L23/544 | 主分类号 | H01L23/544 |
| 代理机构 | Dicke, Billig & Czaja, PLLC | 代理人 | Dicke, Billig & Czaja, PLLC |
| 主权项 | 1. A semiconductor chip comprising: a first mark for identifying a position of the chip within an exposure field; a first matrix in a first layer of the chip; and a second mark within the first matrix identifying a position of the exposure field on a wafer. | ||
| 地址 | Neubiberg DE | ||