发明名称 Cooling channel systems for high-temperature components covered by coatings, and related processes
摘要 A method for providing a fluid cooling system within a high temperature component is described. At least one microchannel is formed in an external surface of the component; and one or more coolant passage holes are then formed, extending from at least one of the microchannels to an interior region of the component. A layer of a metallic structural coating is then applied over the external surface. At least one slot, or a set of relatively small passive cooling holes, are then formed through the metallic structural coating; extending into at least a portion of the microchannels. A second coating layer is then applied over the first layer. In some embodiments, a sacrificial material is deposited into the microchannels before the first coating layer is applied. Related articles are also described.
申请公布号 US8753071(B2) 申请公布日期 2014.06.17
申请号 US201012975609 申请日期 2010.12.22
申请人 General Electric Company 发明人 Bunker Ronald Scott
分类号 F01D5/08 主分类号 F01D5/08
代理机构 代理人 Coppa Francis T.
主权项 1. A method for providing a fluid cooling system within a high temperature component, comprising the following steps: a) forming at least one microchannel in an external surface of the component; b) forming one or more coolant passage holes extending from at least one of the microchannels to an interior region of the component; c) filling the microchannels and the coolant passage holes with a filler material; d) applying a first layer of a metallic structural coating over the external surface; e) forming at least one slot or a set of relatively small passive cooling holes through the first layer of the metallic structural coating; wherein the slot or the passive cooling holes extend into at least a portion of one of the filled microchannels which are generally aligned below the slot or below the passive cooling holes; f) removing the filler material; and g) applying at least a second coating layer over the first layer.
地址 Niskayuna NY US