QFN PACKAGE INPROVING A SOLDER JOINT ABILITY AND THE METHOD THEREOF

摘要

Disclosed are a QFN semiconductor package for improving a solder joint ability and a method thereof. For this, the present invention provides a QFN semiconductor package for improving a solder joint ability which includes a step of firstly cutting a second surface which is the base side of a lead part with 70-99.5% of the entire thickness among the lead frame of a matrix shape where a semiconductor chip is mounted and a molding process is completed, a step of performing an electrolyte plating process on the result and forming a plating layer in the second surface of the lead part and the lateral surface of the firstly cut lead part, and a step of performing a second cutting process on the firstly cut region and separating individual semiconductor packages by cutting the residual part of the lead part, and a method thereof. Therefore, a solder joint ability can be improved by forming a plating layer in the lateral surface of the QFN semiconductor package when a semiconductor package is mounted on a PCB.