发明名称 PREFABRICATED LED PACKAGE
摘要 <p>The present invention relates to a prefabricated LED package which can be simply detachable and stably fixed to an object such as a substrate or a wall by a screw. According to one embodiment of the present invention, provided is a prefabricated LED package which includes an LED chip; a package body which is mounted in the LED chip and has a female screw part on one surface thereof; at least one lead frame terminal which is supported by the package body and is electrically connected to the LED chip; and a base part which has a male screw part combined with the female screw part on one surface thereof.</p>
申请公布号 KR20140073776(A) 申请公布日期 2014.06.17
申请号 KR20120141624 申请日期 2012.12.07
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM, TAE KWANG
分类号 H01L33/48;H01L33/62;H01L33/64 主分类号 H01L33/48
代理机构 代理人
主权项
地址