| 摘要 |
<p>The present invention relates to a transfer module and, more specifically, to a transfer module in which a position of a wafer is accurately measured and the center of the wafer is accurately located in the center of a mounting portion of a process module by minimizing a measuring range of position coordinates of the wafer, which passes through an opening formed on a coupling surface of the transfer module, to be limited within a space between the top surface and the bottom surface of the opening. Thereby, accurate processing of the wafer in the process module can be conducted.</p> |
