| 摘要 |
Provided are at least one technology and a system or a related brush for cleaning a wafer during manufacture of a semiconductor. In an embodiment, the brush includes a brush body and at least one inner hole support member in the brush body. For example, a first inner hole support member and a second inner hole support member define a first inner hole associated with a first size. For example, a third inner hole support member and a fourth inner hole support member define a second inner hole associated with a second size different from the first size. In an embodiment, a cleansing solution is applied to a wafer based on a first fluid amount at a first brush position and based on a second fluid amount at a second brush position. In the way above, a fluid amount associated with cleansing the water is provided so that cleaning efficiency is improved. |
