METHOD OF FINISHING SIDE SURFACES OF TRANSPARENT SUBSTRATE FOR DISPLAY DEVICE AND FINISHING APPARATUS USING SAME

摘要

The present invention relates to a method of processing a lateral side of a transparent substrate for a display device, and a processing apparatus using the same comprising: a substrate preparing step for preparing a transparent substrate having a size used for a display device; a laser beam entering step for entering a first laser beam into a lateral side by moving the first laser beam oscillated from a laser beam irradiator at an incline as much as a first gradient from the outside of the transparent substrate to the edge of the lateral side of the transparent substrate; a laser beam moving step for performing a polishing process of the lateral side by irradiating the lateral side circumference of the transparent substrate with the first laser beam while moving the first laser beam to the lateral side of the transparent substrate; and a laser beam separating step for separating the first laser beam to the outside of the lateral side by moving the first laser beam oscillated from the laser beam irradiator at an incline as much as a second gradient from the lateral side of the transparent substrate to the edge of the lateral side of the transparent substrate. Therefore, the deviation for introducing energy from laser beam to the lateral side of the transparent substrate is reduced, so a microcrack due to thermal stress in the lateral side of the transparent substrate can be prevented.