发明名称 TEMPERATURE SENSOR UNIT FOR HOT STAMPING MOLD
摘要 Provided is a temperature sensor unit for a hot stamping mold. The temperature sensor unit according to an embodiment of the present invention for a hot stamping mold with a lower mold, an upper mold, and a cooling space unit between the lower and upper molds regarding a welding unit of the hot stamping molding target material, comprises the following: a sensor holder which includes a connection hole formed from one side of the upper mold to the vicinity of the cooling space unit while a sensor hole is formed in the connection hole to be connected to the cooling space unit, is connected to the mold by being inserted into the connection hole, has a cable hole in the inside, and has a sensor connection hole in the center of the inner section; a temperature sensor which is connected to the sensor connection hole of the sensor holder, has a sensing end being inserted into the sensor hole and exposed to the cooling space, and allows a cable to be connected to an external controller via the cable hole; and a sealing which is located between the inner section of the sensor holder and the inner side of the connection hole to secure a sealed state, wherein the temperature sensor is directly exposed to cooling fluid in the cooling space unit to detect the real time temperature of the cooling fluid and to output a temperature signal to a controller.
申请公布号 KR20140072928(A) 申请公布日期 2014.06.16
申请号 KR20120129752 申请日期 2012.11.15
申请人 SUNG WOO HITECH CO., LTD. 发明人 LEE, MUN YONG;JEONG, YOON SEONG
分类号 B21D22/02;B21D37/16;G01K1/14 主分类号 B21D22/02
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