| 摘要 |
A semiconductor assembly (10) comprises a stack (38) with a semiconductor module (20a) and a cooler (30a), wherein the semiconductor module (20a) is provided in contact with the cooler (30a). A clamping assembly (40) is adapted to exert a force (F) on the two sides of the stack. The stack is provided with a through hole (26, 36) between the two sides thereof and a part of the clamping assembly (40) comprises an electrically conductive part which extends through the through hole (26, 36) of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution. |
