| 发明名称 |
LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A light emitting package includes a circuit board, a light emitting chip disposed on the circuit board and electrically connected to the circuit board, a resin layer disposed on the light emitting chip, and a fluorescent layer disposed on the resin layer. The light emitting chip is disposed between the resin layer and the circuit board. The resin layer is disposed between the light emitting chip and the fluorescent layer. For a light, a refractive index of the resin layer is smaller than a refractive index of the light emitting chip and is larger than a refractive of the fluorescent layer. |
| 申请公布号 |
US2014159085(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201313846658 |
申请日期 |
2013.03.18 |
| 申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
YANG Jung-Hyun;KWON Myung-Seok;PARK Young-Min |
| 分类号 |
H01L21/66;H01L33/58 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting package comprising:
a circuit board; a light emitting chip disposed on the circuit board and electrically connected to the circuit board; a resin layer disposed on the light emitting chip; and a fluorescent layer disposed on the resin layer, wherein the light emitting chip is disposed between the resin layer and the circuit board, wherein the resin layer is disposed between the light emitting chip and the fluorescent layer, and wherein, for a light, a refractive index of the resin layer is smaller than a refractive index of the light emitting chip and is larger than a refractive of the fluorescent layer.
|
| 地址 |
Yongin-City KR |
