发明名称 SUBSTRATE ADHESION DEVICE AND SUBSTRATE ADHESION METHOD
摘要 PROBLEM TO BE SOLVED: To prevent an air bubble from being left in adhesion resin.SOLUTION: The substrate adhesion device comprises: a display substrate 200 that holds a display substrate 101 having a display surface; a cover substrate 11 that holds a cover substrate 121 covering the display surface; and a guide pattern 150 that is provided at a holding plate part 111 of the cover substrate 11, faces a route in which ultraviolet curing resin coated onto the cover substrate 121 and bonding both substrates is easy to move, presses a surface opposite a surface of the cover substrate 121 facing the display substrate 101 and guides a movement of the ultraviolet curing resin. The route is identified on the basis of a pattern to be formed by the ultraviolet curing resin attached onto the cover substrate 121, when both substrates 101 and 121 are arranged in parallel, the same amount of the ultraviolet curing resin as that for use in bonding the substrate is coated onto at least one of both substrates 101 and 121 and both substrates 101 and 121 are caused to be separated from each other as keeping both substrates in parallel.
申请公布号 JP2014109611(A) 申请公布日期 2014.06.12
申请号 JP20120262666 申请日期 2012.11.30
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 NONAKA KOHEI;YAMAZAKI FUJIO
分类号 G09F9/00;G02F1/1333 主分类号 G09F9/00
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