发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 <p>Provided are a semiconductor memory device and a method of fabricating the same. The semiconductor memory device includes a semiconductor substrate including a first trench defining active areas in a first area and a second trench formed in a second area near the first area, a gate electrode which crosses the active areas in the first area, a charge storing pattern disposed between the gate electrode and the active areas, a blocking insulation film extending from the first trench between the gate electrode and the charge storing pattern and defining a first are gap in the first trench, and an insulation pattern spaced from a bottom surface of the second trench and defining a second are gap in the second trench, in which the first and second trenches may have the substantially same depth and a vertical height of the first are gap may be larger than a vertical height of the second air gap.</p>
申请公布号 KR20140071786(A) 申请公布日期 2014.06.12
申请号 KR20120139774 申请日期 2012.12.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SIM, JAE HWANG;SHIN, JIN HYUN;LEE, JONG MIN
分类号 H01L21/8242;H01L21/31;H01L27/105 主分类号 H01L21/8242
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