发明名称 |
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME |
摘要 |
<p>Provided are a semiconductor memory device and a method of fabricating the same. The semiconductor memory device includes a semiconductor substrate including a first trench defining active areas in a first area and a second trench formed in a second area near the first area, a gate electrode which crosses the active areas in the first area, a charge storing pattern disposed between the gate electrode and the active areas, a blocking insulation film extending from the first trench between the gate electrode and the charge storing pattern and defining a first are gap in the first trench, and an insulation pattern spaced from a bottom surface of the second trench and defining a second are gap in the second trench, in which the first and second trenches may have the substantially same depth and a vertical height of the first are gap may be larger than a vertical height of the second air gap.</p> |
申请公布号 |
KR20140071786(A) |
申请公布日期 |
2014.06.12 |
申请号 |
KR20120139774 |
申请日期 |
2012.12.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SIM, JAE HWANG;SHIN, JIN HYUN;LEE, JONG MIN |
分类号 |
H01L21/8242;H01L21/31;H01L27/105 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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