发明名称 LIGHT EMITTNG DEVICE PACKAGE
摘要 <p>According to an embodiment of the present invention, a light emitting device package includes: a package body having grooves formed on the bottom surface thereof; and a light emitting device which is electrically connected to a first lead frame and a second lead frame, is arranged on the bottom surface of the package body, and includes protrusion parts in an area touching the bottom surface. The protrusion parts are inserted into the grooves.</p>
申请公布号 KR20140071610(A) 申请公布日期 2014.06.12
申请号 KR20120139362 申请日期 2012.12.04
申请人 LG INNOTEK CO., LTD. 发明人 SONG, YONG SEON
分类号 H01L33/48;H01L33/54 主分类号 H01L33/48
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