ELECTRONIC COMPONENT AND FABRICATION PROCESS OF THIS ELECTRONIC COMPONENT

摘要

An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg−1K−1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.

主权项

1. A manufacture comprising an electronic component, said electronic component comprising a substrate that extends in substrate plane, said substrate having electrical connections to connect said electronic component to an electronic circuit, said substrate having an upper face, an electronic chip arranged on said upper face of said substrate and/or inside said substrate, said electronic chip being electrically connected to said electrical connections by way of said substrate, a thick layer forming a package, said thick layer comprising an electrically insulating material covering one of said upper face of said substrate and at least part of said electronic chip, said thick layer having an outer face parallel to said substrate plane, a cavity produced inside said thick layer and situated above said electronic chip in a direction perpendicular to said substrate plane, said cavity having a bottom parallel to said substrate plane and a side wall extending from said bottom as far as said outer face of said thick layer, said cavity being at least partly filled with a heat-absorbing material, said heat-absorbing material being different from a material forming said thick layer, wherein said heat-absorbing material has a specific heat capacity that is greater than 1 kJKg−1K−1 at a temperature of 25° C. and at a pressure of 100 kPa, and wherein at least one of a bottom of said cavity and a side wall of said cavity is covered with a thermal interface layer.