发明名称 APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND METHOD OF MOUNTING A SEMICONDUCTOR CHIP
摘要 <p>The present invention provides a recognizing apparatus capable of recognizing the height of a recognition object by a simple configuration. The recognizing apparatus comprises: a cylindrical lens (30) which has a different focal distance at a predetermined cross section 2; a chip camera (2) which photographs an IC chip (4) having a spherical bump (4a) through the cylindrical lens (30); and a signal processing part which recognizes the height of the pump (4a) by being based on the distortion amount of a globular shape among images photographed by the chip camera (2).</p>
申请公布号 KR20140071895(A) 申请公布日期 2014.06.12
申请号 KR20130141252 申请日期 2013.11.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHINJI UEYAMA;MASATO KAJINAMI;MITSUHIRO TOGASHI;YOSHIAKI YUKIMORI
分类号 G01B11/00;H05K13/04 主分类号 G01B11/00
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