| 摘要 |
The present invention relates to a method for manufacturing a LED and a solar cell circuit board which increases a heat radiation effect and prevents easy elimination when performing wire bonding and soldering by increasing junction adhesion between a ceramic thin plate for heat radiation and a metal paste. The method of the present invention comprises: forming a circuit wiring pattern layer with a tungsten paste on an upper surface of a flexible ceramic green sheet, and burning at 1600 degrees Celsius; performing nickel, gold, or silver plating on each side of the circuit wiring pattern layer formed; and impregnating the tungsten paste by drilling a plurality of holes on the ceramic green sheet except the circuit wiring pattern layer of the ceramic green sheet. |
