| 摘要 |
PURPOSE:To prevent a lead frame from levitating, to uniformize wettability of liquid-like adhesive paste and to eliminate the irregularity of a bonding strength by retaining the frame by a retaining lever, and retaining the coated paste by a retaining rod. CONSTITUTION:A lead frame 3 fed by a conveying mechanism is retained by a retaining lever 10, and liquid-like adhesive paste 2 is uniformly and accurately coated. After it is coated with the paste 2, when the predetermined frame 3 is coated with the paste 2, the already coated paste 2 is retained by a retaining rod 5. Thus, the wettability of the frame 3 with the paste 2 is improved. Accordingly, the reliability of the step of die bonding a semiconductor with the paste is improved to enhance the yield of assembling the element. |
