| 摘要 |
PROBLEM TO BE SOLVED: To provide a cassette for a wafer frame capable of transporting a large-diameter semiconductor wafer and a wafer frame with safety, and of contributing to improvement in assemblability and workability.SOLUTION: A cassette for a wafer frame comprises: a cassette 10 housing a wafer frame of a semiconductor wafer; and plurality of shelf boards 20 provided at both side parts of the cassette 10 so as to be opposed to each other, and that can support the wafer frame by shelf pieces 22. The cassette 10 is divided into a lower frame body 30 and an upper frame body 40. The lower frame body 30 is formed in a substantially U-shape in a vertical cross section, and in the vicinity of an upper end of both side parts 31 thereof, a plurality of first engaging pieces 32 are juxtaposed with a predetermined gap in a front and rear direction. The upper frame body 40 is formed in a substantially inverted U-shape in a vertical cross section, and in the vicinity of a lower end of both side parts 41 thereof, a plurality of second engaging pieces 42 are juxtaposed with a predetermined gap in a front and rear direction. When the lower frame body 30 and the upper frame body 40 are assembled, the second engaging piece 42 is engaged between the plurality of first engaging pieces 32, and a held flange 48 is held between the first and second engaging pieces 32 and 42. |
